ISO-690 (author-date, English)

DHARANI, Bandharla, YANG, Fu-Siang, LU, Po-Wei, YANG, Ping-Feng und FANG, Jen-Kuang, 2025. Back Side (BS) Grinding Process on 300 mm Panel Fan-Out for High Performance Computing (HPC) Applications. In: . 21 Oktober 2025.

Elsevier - Harvard (with titles)

Dharani, B., Yang, F.-S., Lu, P.-W., Yang, P.-F., Fang, J.-K., 2025. Back Side (BS) Grinding Process on 300 mm Panel Fan-Out for High Performance Computing (HPC) Applications, in: . https://doi.org/10.1109/IMPACT67645.2025.11281714

American Psychological Association 7th edition

Dharani, B., Yang, F.-S., Lu, P.-W., Yang, P.-F., & Fang, J.-K. (2025, Oktober 21). Back Side (BS) Grinding Process on 300 mm Panel Fan-Out for High Performance Computing (HPC) Applications. https://doi.org/10.1109/IMPACT67645.2025.11281714

Springer - Basic (author-date)

Dharani B, Yang F-S, Lu P-W, Yang P-F, Fang J-K (2025) Back Side (BS) Grinding Process on 300 mm Panel Fan-Out for High Performance Computing (HPC) Applications

Juristische Zitierweise (Stüber) (Deutsch)

Dharani, Bandharla/ Yang, Fu-Siang/ Lu, Po-Wei/ Yang, Ping-Feng/ Fang, Jen-Kuang, Back Side (BS) Grinding Process on 300 mm Panel Fan-Out for High Performance Computing (HPC) Applications, 2025, .

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