• Back Side (BS) Grinding Proces...

Treffer: Back Side (BS) Grinding Process on 300mm Panel Fan-Out for High Performance Computing (HPC) Applications

Title:
Back Side (BS) Grinding Process on 300mm Panel Fan-Out for High Performance Computing (HPC) Applications
Authors:
Dharani, Bandharla, Yang, Fu-Siang, Lu, Po-Wei, Yang, Ping-Feng, Fang, Jen-Kuang
Source:
2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2025 20th International. :301-304 Oct, 2025
Relation:
2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Database:
IEEE Xplore Digital Library