DENG, L., WANG, Y., YUE, Z. und LI, Z., 2025. A Robotic Tactile Excavation System for Excavating Objects Buried in Granular Materials. IEEE/ASME Transactions on Mechatronics, Mechatronics, IEEE/ASME Transactions on, IEEE/ASME Trans. Mechatron. 1 Dezember 2025. Vol. 30, no. 6, p. 7112-7124. DOI 10.1109/TMECH.2025.3532613.
Elsevier - Harvard (with titles)Deng, L., Wang, Y., Yue, Z., Li, Z., 2025. A Robotic Tactile Excavation System for Excavating Objects Buried in Granular Materials. IEEE/ASME Transactions on Mechatronics, Mechatronics, IEEE/ASME Transactions on, IEEE/ASME Trans. Mechatron. 30, 7112-7124. https://doi.org/10.1109/TMECH.2025.3532613
American Psychological Association 7th editionDeng, L., Wang, Y., Yue, Z., & Li, Z. (2025). A Robotic Tactile Excavation System for Excavating Objects Buried in Granular Materials. IEEE/ASME Transactions on Mechatronics, Mechatronics, IEEE/ASME Transactions On, IEEE/ASME Trans. Mechatron., 30(6), 7112-7124. https://doi.org/10.1109/TMECH.2025.3532613
Springer - Basic (author-date)Deng L, Wang Y, Yue Z, Li Z (2025) A Robotic Tactile Excavation System for Excavating Objects Buried in Granular Materials. IEEE/ASME Transactions on Mechatronics, Mechatronics, IEEE/ASME Transactions on, IEEE/ASME Trans. Mechatron. 30:7112-7124. https://doi.org/10.1109/TMECH.2025.3532613
Juristische Zitierweise (Stüber) (Deutsch)Deng, L./ Wang, Y./ Yue, Z./ Li, Z., A Robotic Tactile Excavation System for Excavating Objects Buried in Granular Materials, IEEE/ASME Transactions on Mechatronics, Mechatronics, IEEE/ASME Transactions on, IEEE/ASME Trans. Mechatron. 2025, 7112-7124.