ISO-690 (author-date, English)

DE VENUTO, D. und SAUTER, T., 2018. Foreword Embedded Sensor Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manufact. Technol. 1 Juli 2018. Vol. 8, no. 7, p. 1133-1133. DOI 10.1109/TCPMT.2018.2850700.

Elsevier - Harvard (with titles)

De Venuto, D., Sauter, T., 2018. Foreword Embedded Sensor Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manufact. Technol. 8, 1133-1133. https://doi.org/10.1109/TCPMT.2018.2850700

American Psychological Association 7th edition

De Venuto, D., & Sauter, T. (2018). Foreword Embedded Sensor Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions On, IEEE Trans. Compon., Packag. Manufact. Technol., 8(7), 1133-1133. https://doi.org/10.1109/TCPMT.2018.2850700

Springer - Basic (author-date)

De Venuto D, Sauter T (2018) Foreword Embedded Sensor Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manufact. Technol. 8:1133-1133. https://doi.org/10.1109/TCPMT.2018.2850700

Juristische Zitierweise (Stüber) (Deutsch)

De Venuto, D./ Sauter, T., Foreword Embedded Sensor Systems, IEEE Transactions on Components, Packaging and Manufacturing Technology, Components, Packaging and Manufacturing Technology, IEEE Transactions on, IEEE Trans. Compon., Packag. Manufact. Technol. 2018, 1133-1133.

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