Treffer: Finite element simulation of thermomechanical stress evolution in Cu/low-k interconnects during manufacturing and subsequent thermal cycling
Title:
Finite element simulation of thermomechanical stress evolution in Cu/low-k interconnects during manufacturing and subsequent thermal cycling
Authors:
Source:
Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005. Solid-State Device Research Conference Solid-State Device Research Conference, 2005. ESSDERC 2005. Proceedings of 35th European. :493-496 2005
Relation:
Proceedings of ESSDERC 2005. 31st European Solid-State Device Research Conference
Database:
IEEE Xplore Digital Library