Treffer: Modelling Thermal Impedance of Electronic Devices Using a Thermal Network Model
Title:
Modelling Thermal Impedance of Electronic Devices Using a Thermal Network Model
Authors:
Source:
2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2025 IEEE 31st International Symposium for. :310-313 Oct, 2025
Relation:
2025 IEEE 31st International Symposium for Design and Technology in Electronic Packaging (SIITME)
Database:
IEEE Xplore Digital Library