• First Implementation of Monoli...

Treffer: First Implementation of Monolithic Integrated Cim with 1Mb Ultra-High-Density 8-Layer 3D VRRAM, Achieving High Computing Density ($204.8 \text{GOPs} / \text{mm}^{2}$) and FoM ($\mathbf{2. 1 3} \times \mathbf{1 0}^{\mathbf{6}} \text{GOPS}^{\mathbf{2}} / \mathbf{W} / \text{mm}^{\mathbf{2}}$) for Efficient Scientific Computing

Title:
First Implementation of Monolithic Integrated Cim with 1Mb Ultra-High-Density 8-Layer 3D VRRAM, Achieving High Computing Density ($204.8 \text{GOPs} / \text{mm}^{2}$) and FoM ($\mathbf{2. 1 3} \times \mathbf{1 0}^{\mathbf{6}} \text{GOPS}^{\mathbf{2}} / \mathbf{W} / \text{mm}^{\mathbf{2}}$) for Efficient Scientific Computing
Authors:
Ma, Cailian, Sun, Wenxuan, Nie, Long, Li, Yao, Wu, Yue, Fan, Zichen, Tang, Weiye, Zhang, Kaiping, Liu, Yu, Zhao, Shengjie, Zhang, Peiwen, Zhang, Shuaidi, Xu, Xiaoxin, Zhang, Feng, Liu, Ming
Source:
2025 Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2025 Symposium on. :1-3 Jun, 2025
Relation:
2025 Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
Database:
IEEE Xplore Digital Library