XIA, Zihan, SONG, Chihun, KRISHNA, Ram, VICTOR, Ashita, PENTA, Srujan, BAKIR, Muhannad S, ROSENBAUM, Elyse, KIM, Nam Sung und KANG, Mingu, 2025. Exploiting Chiplet Integration Technology for Fast High-Capacity DRAM Modules. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol 33, iss 5. 1 Januar 2025. DOI 10.1109/tvlsi.2025.3527976.
Elsevier - Harvard (with titles)Xia, Z., Song, C., Krishna, R., Victor, A., Penta, S., Bakir, M.S., Rosenbaum, E., Kim, N.S., Kang, M., 2025. Exploiting Chiplet Integration Technology for Fast High-Capacity DRAM Modules. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol 33, iss 5. https://doi.org/10.1109/tvlsi.2025.3527976
American Psychological Association 7th editionXia, Z., Song, C., Krishna, R., Victor, A., Penta, S., Bakir, M. S., Rosenbaum, E., Kim, N. S., & Kang, M. (2025). Exploiting Chiplet Integration Technology for Fast High-Capacity DRAM Modules. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol 33, Iss 5. https://doi.org/10.1109/tvlsi.2025.3527976
Springer - Basic (author-date)Xia Z, Song C, Krishna R, Victor A, Penta S, Bakir MS, Rosenbaum E, Kim NS, Kang M (2025) Exploiting Chiplet Integration Technology for Fast High-Capacity DRAM Modules. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol 33, iss 5. https://doi.org/10.1109/tvlsi.2025.3527976
Juristische Zitierweise (Stüber) (Deutsch)Xia, Zihan/ Song, Chihun/ Krishna, Ram/ Victor, Ashita/ Penta, Srujan/ Bakir, Muhannad S/ Rosenbaum, Elyse/ Kim, Nam Sung/ Kang, Mingu, Exploiting Chiplet Integration Technology for Fast High-Capacity DRAM Modules, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol 33, iss 5 2025.