KIM, Moo Hyun und KIM, Tae Seon, 2024. Development of a Wafer Defect Pattern Classifier Using Polar Coordinate System Transformed Inputs and Convolutional Neural Networks. Electronics (2079-9292). 1 April 2024. Vol. 13, no. 7, p. 1360-1391. DOI 10.3390/electronics13071360.
Elsevier - Harvard (with titles)Kim, M.H., Kim, T.S., 2024. Development of a Wafer Defect Pattern Classifier Using Polar Coordinate System Transformed Inputs and Convolutional Neural Networks. Electronics (2079-9292) 13, 1360-1391. https://doi.org/10.3390/electronics13071360
American Psychological Association 7th editionKim, M. H., & Kim, T. S. (2024). Development of a Wafer Defect Pattern Classifier Using Polar Coordinate System Transformed Inputs and Convolutional Neural Networks. Electronics (2079-9292), 13(7), 1360-1391. https://doi.org/10.3390/electronics13071360
Springer - Basic (author-date)Kim MH, Kim TS (2024) Development of a Wafer Defect Pattern Classifier Using Polar Coordinate System Transformed Inputs and Convolutional Neural Networks.. Electronics (2079-9292) 13:1360-1391. https://doi.org/10.3390/electronics13071360
Juristische Zitierweise (Stüber) (Deutsch)Kim, Moo Hyun/ Kim, Tae Seon, Development of a Wafer Defect Pattern Classifier Using Polar Coordinate System Transformed Inputs and Convolutional Neural Networks., Electronics (2079-9292) 2024, 1360-1391.